Corner-3

Technological equipment

  • wet chemical processes in clean room (SDE, alkaline and acidic texturing, substrates cleaning)
  • clean room for high temperature processes (Class 100)
  • laser processes (cutting, edge isolation, drilling, ablation)
  • sputtering (metal - Ti, Cu, Al/dielectric layers - SiNX, AlNX, Al2O3)
  • electroplating (acidic Cu, Sn, Ni/alkaline Cu, Ag)
  • RTP processes (Rapid Thermal Processing)
  • substrate cutting (diamond wheel saw)
  • lab for solar module processing
  • screen-printing and IR belt firing furnace
  • CVD processes (LPCVD, PECVD)
  • oxidation process (dry and wet)
  • diffusion processes (POCl3 , BBr3)
  • climatic chamber - 1.8 x 1.8 x 2.3 m
  • photolithography

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