Technological equipment
- wet
chemical processes in clean room (SDE, alkaline and acidic texturing, substrates
cleaning)
- clean room
for high temperature processes (Class 100)
- laser
processes (cutting, edge isolation, drilling, ablation)
- sputtering (metal - Ti, Cu, Al/dielectric layers - SiNX, AlNX, Al2O3)
- electroplating
(acidic Cu, Sn, Ni/alkaline Cu, Ag)
- RTP
processes (Rapid Thermal Processing)
- substrate
cutting (diamond wheel saw)
- lab for
solar module processing
- screen-printing
and IR belt firing furnace
- CVD
processes (LPCVD, PECVD)
- oxidation
process (dry and wet)
- diffusion
processes (POCl3 , BBr3)
- climatic chamber - 1.8 x 1.8 x 2.3 m
- photolithography
Image gallery