Technological equipment
- wet chemical processes in clean room (SDE, alkaline and acidic texturing, substrates cleaning)
- clean room for high temperature processes (Class 100)
- laser processes (cutting, edge isolation, drilling, ablation)
- sputtering (metal - Ti, Cu, Al/dielectric layers - SiNX, AlNX, Al2O3)
- electroplating (acidic Cu, Sn, Ni/alkaline Cu, Ag)
- RTP processes (Rapid Thermal Processing)
- substrate cutting (diamond wheel saw)
- lab for solar module processing
- screen-printing and IR belt firing furnace
- CVD processes (LPCVD, PECVD)
- oxidation process (dry and wet)
- diffusion processes (POCl3 , BBr3)
- climatic chamber - 1.8 x 1.8 x 2.3 m
- photolithography
Image gallery
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